AOI solution for 3D Wirebond
Multi mode usage (standalone smart-scope, semi-automatic & full automatic with inline integration).
Capable to inspect product like: optoelectronics, semiconductors, PCBA, transparent or translucent materials such as LED Wirebond & Lenses.
Capable to focus on different height (e.g. LED wirebond & lenses)
Also capable to change magnification for different products/specific objects.
Other inspections like 3rd Optical & 100% VI inspection, Bottom inspection and WLP (Wafer Level Packaging) inspection and more …
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