AOI solution for Die Inspection
Multi mode usage (standalone smart-scope, semi-automatic & full automatic with inline integration).
Capable to inspect product like: semiconductors, optoelectronics, wafer, strips, substrate, carrier or user made jig/fixtures.
Also capable to focus on different heights & change magnification for different products.
Other inspections like Bottom Inspection & WLP (Wafer Level Packaging) Inspection and more…
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