Die Inspection

Die Inspection

  • 3in1 system.
  • Multi mode usage (standalone smart-scope, semi-automatic & full automatic with inline integration).
  • Capable to inspect product like: semiconductors, optoelectronics, wafer, strips, substrate, carrier or user made jig/fixtures.
  • Also capable to focus on different heights & change magnification for different products.
  • Other inspections like Bottom Inspection & WLP (Wafer Level Packaging) Inspection and more…

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