OPTOELECTRONIC INDUSTRY
Inspection Products
LED and other optoelectronics products and more…
Inspection Capabilities
Top Surface
Chipped package, No Marking alignment, Incomplete mark, Double mark, Contamination, Bubble, No Resin, Excess resin(Overfill), Mix device, Mixed colour, Limited Die & Wirebond Detection.
Bottom Surface
Lead related defects, Package Chipping, Damage, Resin Overflows, Contamination.
Side Surface
Lead related defects, Package chipping, Damage, Contamination.
