SEMICONDUCTOR INDUSTRY
Inspection Products
Various types of wafer, wirebond, substrate, die attached, pallet, leadframe, tape and reel and PCB components
![](http://corteximaging.com.my/wp-content/uploads/2021/07/xinspection-products-1.png.pagespeed.ic.YZnZAiy7WA.png)
![](http://corteximaging.com.my/wp-content/uploads/2021/07/xinspection-products-2.png.pagespeed.ic.Y5R2lT1p_V.png)
![](http://corteximaging.com.my/wp-content/uploads/2021/07/inspection-products-3.png.pagespeed.ce.MPm1BWJvKa.png)
![](http://corteximaging.com.my/wp-content/uploads/2021/07/xinspection-products-4.png.pagespeed.ic.mFWHH7dKNa.png)
![](http://corteximaging.com.my/wp-content/uploads/2021/07/inspection-products-5.png.pagespeed.ce.8zyF3UddC3.png)
Inspection Features
Colour, Mono and SWIR Inspection (Inner layer)
![](http://corteximaging.com.my/wp-content/uploads/2021/07/xcolour-camera.png.pagespeed.ic.ySxSQbkugr.png)
Colour Camera
![](http://corteximaging.com.my/wp-content/uploads/2021/07/xmono-camera.png.pagespeed.ic.jyfMGjRwA5.png)
Mono Camera
![](http://corteximaging.com.my/wp-content/uploads/2021/07/xSWIR-camera.png.pagespeed.ic.i6ma0JkBX9.png)
SWIR Camera
![](http://corteximaging.com.my/wp-content/uploads/2021/07/xsemiconductor-line-scan.png.pagespeed.ic.zGQFqN9nTx.png)
Line Scan Inspection
Suitable for long piece, continuous objects Inspection. EG: Leadframe package inspection or tape and reel inspection
![](http://corteximaging.com.my/wp-content/uploads/2021/07/xsemiconductor-area-scan.png.pagespeed.ic.RUvXxm1czs.png)
Area Scan Inspection
Suitable for one individual objects inspection
Inspection Capabilities
Package Inspection
![](http://corteximaging.com.my/wp-content/uploads/2021/07/xrough-surface.png.pagespeed.ic.UthpYa8jJg.png)
Rough Surface
![](http://corteximaging.com.my/wp-content/uploads/2021/07/xvoid.png.pagespeed.ic.FAgUDQBd16.png)
Void
![](http://corteximaging.com.my/wp-content/uploads/2021/07/xpackage-scratches.png.pagespeed.ic.XlW4-xGPpJ.png)
Package Scratches
![](http://corteximaging.com.my/wp-content/uploads/2021/07/xincomplete-fill.png.pagespeed.ic.6XZdqFoGMj.png)
Incomplete Fill
![](http://corteximaging.com.my/wp-content/uploads/2021/07/xcrown-flash.png.pagespeed.ic.vamHT_plmY.png)
Crown Flash
![](http://corteximaging.com.my/wp-content/uploads/2021/07/xid-pin-height.png.pagespeed.ic.RlbAWU7lYN.png)
ID pin Height
![](http://corteximaging.com.my/wp-content/uploads/2021/07/xchip-on-package.png.pagespeed.ic.b0ftXjALA4.png)
Chip on Package
![](http://corteximaging.com.my/wp-content/uploads/2021/07/xraised-flag.png.pagespeed.ic.dDcIdIYprK.png)
Raised Flag
![](http://corteximaging.com.my/wp-content/uploads/2021/07/xpackage-offset.png.pagespeed.ic.Las6kmLU4E.png)
Package Offset
![](http://corteximaging.com.my/wp-content/uploads/2021/07/xforeign-material_1.png.pagespeed.ic._VGloxc2Du.png)
Foreign Material
![](http://corteximaging.com.my/wp-content/uploads/2021/07/xpin-1-chip.png.pagespeed.ic.AyRos0-jNg.png)
Pin 1 Chip
![](http://corteximaging.com.my/wp-content/uploads/2021/07/xflash-on-EP.png.pagespeed.ic.hoPpVgj4GN.png)
Flash on EP
Inspection Capabilities
Tape & Reel Inspection
![](http://corteximaging.com.my/wp-content/uploads/2021/07/xscratch_1.png.pagespeed.ic.0VOonle9rU.png)
Scratch
![](http://corteximaging.com.my/wp-content/uploads/2021/07/xchip-out.png.pagespeed.ic.skDlpZWEKv.png)
Chip Out
![](http://corteximaging.com.my/wp-content/uploads/2021/07/xwrong-marking.png.pagespeed.ic.62C5vONguv.png)
Wrong Marking
![](http://corteximaging.com.my/wp-content/uploads/2021/07/xwrong-orientation.png.pagespeed.ic.7YJissLf4u.png)
Wrong Orientation
![](http://corteximaging.com.my/wp-content/uploads/2021/07/xforeign-material_2.png.pagespeed.ic.72PG05xty9.png)
Foreign Material
![](http://corteximaging.com.my/wp-content/uploads/2021/07/xlead-bend.png.pagespeed.ic.vuzlzUFKzC.png)